Types of the Copper Clad Laminates

Copper clad laminates (CCLs) are available in a variety of types classified according to different standards. Here are some common types:

• According to mechanical rigidity, they can be divided into two types: rigid CCL and flex CCL.
• According to insulation material and structures,they canbe categorized as organic resin CCL, metal-base CCL, ceramic-base CCL, etc.
• According to reinforcing material types, they can be classified as glass fiber cloth base CCL, paper base CCL, and compound CCL.
• According to applied insulation resin, they can be classified as epoxy resin CCL and Phenolic CCL.

Here, we introduce some common types of them in detail:

Rigid Copper Clad Laminates(RCCL): It refers to a kind of Copper Clad Laminate employed in the production of rigid pcbs. It involves bonding a copper foil layer to a rigid substrate material like fiberglass-enhanced epoxy resin or phenolic resin. The heightened rigidity and steadiness of RCCL additionally establish its suitability for employment in circuits characterized by high density, rapid signal transmission, and elevated frequencies. These attributes of enhanced mechanical strength, rigidity, and stability contribute to the widespread popularity of this material.

Flexible Copper Clad Laminates(FCCL): FCCL is a variation of Copper Clad Laminate utilized in the fabrication of flexible circuit boards. It entails the lamination of a copper foil layer onto a flexible substrate material like polyimide or polyester film. FCCL is flexible and adaptable, making it ideal for applications requiring bent or curved PCBs

FR-4: FR-4, the most extensively employed Copper Clad Laminate variant, comprises a woven fiberglass base infused with a flame-retardant epoxy resin. Renowned for its exceptional electrical insulation capabilities, robust mechanical strength, and remarkable thermal resistance, FR-4 finds suitability across a diverse array of applications, encompassing consumer electronics, telecommunications, and automotive electronics.

CEM-1 and CEM-3: CEM-1 (Composite Epoxy Material-1) and CEM-3 (Composite Epoxy Material-3) share similarities with FR-4, but they utilize a non-woven fiberglass substrate as opposed to a woven one. CEM-1 is commonly employed for single-sided PCBs, whereas CEM-3 is well-suited for double-sided and multilayer PCBs. These laminates exhibit commendable mechanical strength and maintain dimensional stability.