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CEM3 Copper Clad Laminate
CEM3 Copper Clad Laminate
  1. CEM3 Copper Clad Laminate
  2. CEM3 Copper Clad Laminate

CEM3 Copper Clad Laminate

Category:

Features

◆Cost-effective

◆High glass transition temperature

◆Excellent dimensional stability

◆Better drilling performance

Applications

◆Industry controller

◆Consumer electronics

◆Game machines

Standard size

◆Thickness: 0.6-1.6mm

◆Copper foil: 12um, 15um, 18um, 25um, 35um, 70um

◆Sheet Size: 41×49”

Item Test Condition Unit Specification Value Typical Value
TG DSC °C 110±5 111
Peel Strength 288°C,10S N/mm ≥1.05 1.38
Thermal stress 288°C,solder dip S >10 60 s No delamination
Flexural Strength Warp LW % ≤1.00% 0.36
Fill LW ≤1.00% 0.36
Flammability E24/125 —  UL94 V-0 HB
Surface Resistivity After moisture MΩ ≥1.0X10⁴ 1.41×10⁷
Volume Resistivity After moisture MΩ · cm ≥1.0×10⁶ 1.48×10⁸
Dielectric Constant 1MHZ  C24/23/50 — ≤5.4 4.2
Loss Tangent 1MHZ  C24/23/50 — ≤0.035 0.025
Arc Resistance D48/50 + D0.5/23 S ≥60 120
Dielectric Breakdown D48/50 + D0.5/23 KV ≥40 41
Moisture Absorption D24/23 % ≤0.8 0.3