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Dorchester Center, MA 02124
FR4 Copper Clad Laminate Low TG
Features
◆Low cost , low TG
◆Excellent dimensional stability
Applications
◆Lamp panel
◆Consumer electronics
◆Game machines
Standard size
◆Thickness: 0.6-1.6mm
◆Copper foil: 12um, 15um, 18um, 25um, 35um, 70um
◆Sheet Size: 37×49”,41×49”,43×49”
| Item | Test Condition | Unit | Specification Value | Typical Value |
| TG | DSC | °C | 115±5 | 116 |
| Peel Strength | 288°C,10S | N/mm | ≥1.05 | 1.48 |
| Thermal stress | 288°C,solder dip | S | >10 | 60 s No delamination |
| Flexural Strength | Warp LW | N/mm² | ≥415 | 445 |
| Fill LW | ≥345 | 381 | ||
| Flammability | E24/125 | — | UL94 V-0 | HB |
| Surface Resistivity | After moisture | MΩ | ≥1.0X10⁴ | 5.23×10⁷ |
| Volume Resistivity | After moisture | MΩ · cm | ≥1.0×10⁶ | 5.12×10⁸ |
| Dielectric Constant | 1MHZ C24/23/50 | — | ≤5.4 | 5.3 |
| Loss Tangent | 1MHZ C24/23/50 | — | ≤0.035 | 0.025 |
| Arc Resistance | D48/50 + D0.5/23 | S | ≥60 | 120 |
| Dielectric Breakdown | D48/50 + D0.5/23 | KV | ≥40 | 41 |
| Moisture Absorption | D24/23 | % | ≤0.5 | 0.25 |
