What are the pros and cons of copper cladding?

Advantages of copper clad laminate for circuit boards

1. Excellent electrical conductivity: copper clad laminate for circuit boards can provide high electrical conductivity and can be used for high-speed signal transmission and high current transmission.
2. Good corrosion resistance: The surface of copper clad laminate for circuit boards is coated with a protective copper oxide layer, which can effectively prevent copper from corrosion in humid and acidic environments and extend the life of the circuit board.
3. Easy to process and print: After processing, copper clad laminate for circuit boards can be processed and printed by etching, gold plating, machining and other methods.
4. Convenient for the production of multi-layer circuit boards: copper clad laminate for circuit boards can be used as inner copper foil for the production of multi-layer circuit boards, which can improve the performance and density of circuit boards and reduce the volume of circuit boards.

Disadvantages of copper clad laminate for circuit boards

1. High cost: Compared with other materials such as aluminum substrates, copper clad laminate for circuit boards has a higher manufacturing cost, so the price is relatively expensive.
2. Large thermal expansion coefficient: The thermal expansion coefficient of copper clad laminate for circuit boards is different from that of other materials, which can cause bending and cracking of circuit boards when different temperatures change.
3. Corrosion performance needs to be improved: Although the copper clad laminate of the circuit board has good corrosion resistance, it may still be damaged by strong acid, strong alkali or high temperature, which needs further improvement.